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BD6067GU
● External components Selection Method
<<Constants in the standard circuit example>>
R1: Determines the LED current ILED at power ON.
<Recommended parts>
Datasheet
ILED (mA)
5
15
20
R1[ ? ]
39
13
10
L1: Coil for boost. The recommended value is 22μH. be sure to use a sufficient DC current permissible value and a
sufficient low DC resistance coil.
<Recommended parts>
Inductance value Model number/manufacturer
22μH
NR3015T220M / TAIYO YUDEN
CIN: Bypass capacitor of power supply. This capacitor must be provided to remove an instantaneous power supply noise for
stable voltage supply to this IC. To obtain good characteristics, the low ESR parts like the ceramics capacitor must be
used. The recommended capacitance is 1μF or more.
<Recommended parts>
Capacitance value Model number/manufacturer
1.0μF
GRM188B11A105KA61B / MURATA
COUT: Output smoothing capacitor. The capacitance recommended for BD6067GU is 1.0μF.
<Recommended parts>
Capacitance value Model number/manufacturer
1.0μF
UMK107C105KA-B / TAIYO YUDEN
When selecting capacitors for CIN and COUT, special care should be taken for rated voltage. The desirable rated
voltage is about double the voltage actually applied to the capacitor. When the margin for rated voltage is not sufficient,
the capacitance may be a half or less of the nominal value.
D1: Schottky barrier diode (SBD) for output rectification. To achieve high conversion efficiency, use a diode characterized
by of low Vf, low reverse leak and high current capacity.
<Recommended parts>
Model number/manufacturer
RB160M-40 / ROHM
● Recommended PCB layout
When a PCB designed, the power supply line should be wired in a way that the board impedance can be minimized. If
necessary, the bypass capacitor must be connected. In particular, pins around the DC/DC converter must be wired in such
a way that the wiring impedance can be minimized. In addition, when a DC/DC converter using a coil is used, it is
necessary to place the output capacitor COUT, coil L1, rectification diode D1 and bypass capacitor CIN near this IC and
keep the GND impedance low.
To cell voltage source
CIN
GNDA
EN
VDAC
VIN
VFB
R 1
VOUT
SW
COUT
D 1
GND
To battery GND
L1
Figure 18. PCB Layout Image
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
10/14
TSZ02201-0G3G0C200080-1-2
5.OCT.2012 Rev.001
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